Soon you will be able to stretch thermal diagnostics beyond experimental data with TMX Scientific’s thermal simulation programs. To be a part of beta testing the software, contact TMX Scientific.


T°Solver® is a 3D, ultra-fast, self-adaptive, full-physics thermal simulation engine for analyzing and designing complex microelectronic structures. The engine can resolve the physics in devices whose geometric and temporal features vary widely from the meso to the nano scales.

T°Bridge® (In Development)

TMX Scientific metrology products will work with T°Bridge® to provide full 3D temperature distribution inside an operating electronic device. T°Bridge® will help identify, diagnose, and resolve thermal challenges in microelectronics by combining the measured 2D temperature field with the 3D numerical simulation to infer the full 3D thermal behavior of complex microelectronic devices.